All stories tagged chiplets on The Silicon Valley News.
Intel’s unveiling of the Diamond Rapids server architecture at Hot Chips 2026 marks a decisive shift toward high-bandwidth density and modular compute design for the data center.
While glass-core substrates are poised to revolutionize chip packaging with superior electrical and thermal properties, their commercial deployment remains elusive, challenging industry roadmaps for next-generation silicon.
LG's new maskless Laser Direct Imaging machine aims to solve the critical throughput constraints currently plaguing high-density chip packaging and interconnect scaling.