David covers semiconductors, foundries, and the hardware supply chain for The Silicon Valley News — process nodes, packaging, and the silicon underneath the AI boom.
Nvidia is reportedly reallocating resources from its top-tier consumer graphics cards, the GeForce RTX 5090, to bolster production of AI data center and professional GPUs, signaling a strategic shift driven by overwhelming AI demand.
Virginia attempts to balance soaring electricity demand from AI data centers with its statutory zero-carbon mandates without shifting costs to residents.
A new five-year, $2 billion agreement brings GlobalFoundries into TSMC's advanced packaging ecosystem, utilizing mature US fabs to relieve AI hardware bottlenecks.
Connecticut's latest procurement of 63.4 megawatts of solar capacity faces headwinds as major utilities express reluctance to sign long-term power purchase agreements.
AMD's forthcoming EPYC 'Verano' AI host CPUs, based on the Zen 6 architecture, are reportedly adopting a new SB1 socket, signaling a significant platform shift for high-performance computing and AI server designs.
Tesla's integration of bidirectional charging hardware addresses the fundamental AC-DC divide that has long limited vehicle-to-home backup applications.
The CHIPS Act pivots toward long-term R&D with a massive investment in IBM-backed Anderon, aiming to bridge the gap between lab-scale qubits and industrial manufacturing.
Type One Energy has raised $200 million to deploy its stellarator-based fusion reactor by 2034, leaning on physics approaches designed to solve historical magnetic confinement challenges.
EV charging firm Xeal is set to deploy 100,000 Nvidia GPUs across its U.S. network, transforming idle charging infrastructure into a distributed edge inference compute platform.
With the American energy supply under intense pressure from surging demand, grid-enhancing technologies offer a way to unlock gigawatts of hidden capacity without building new generation.
Qualcomm restructures its Snapdragon PC processor lineup, aiming to address architectural fragmentation and tighten its grip on enterprise clients.
While domestic EV demand faces headwinds, global medium- and heavy-duty electric truck sales have hit record highs, driven by rising diesel prices and maturing fleet technology.
Elon Musk's confirmed discussions with TSMC about the 'Terafab' project suggest a new level of strategic collaboration in advanced chip manufacturing, potentially reshaping how high-volume, specialized silicon is developed and produced.
A developer in Germany has erected the world's tallest wind turbine at nearly 1,200 feet, banking on high-altitude winds to drastically improve capacity factors.
A Californian CEO faces federal charges for allegedly orchestrating a $300 million scheme to illegally export advanced Nvidia AI servers to China, circumventing critical US export controls designed to restrict access to high-performance computing hardware.
The Texas Public Utility Commission authorized Southwestern Public Service Company to shutter its Tolk coal plant, replacing the capacity with wind, solar, and battery storage.
Huawei and DeepSeek have released a comprehensive suite of open-source programming tools for the Ascend 950 AI chips, aiming to simplify development and foster an alternative ecosystem to Nvidia's CUDA.
A newly unveiled U.S. Senate energy permitting bill attempts to untangle high-voltage transmission deployment, promising reliability gains and cost savings if it survives legislative hurdles.
Gears of War: E-Day's pioneering integration of Unreal Engine 5's MegaLights technology showcases unprecedented demands on GPU hardware, particularly for ray-traced lighting, signaling a significant shift in graphics rendering paradigms and future GPU architectural priorities.
BYD's upcoming flagship sedan will integrate its first solid-state battery architecture alongside coach doors, pushing advanced chemistry into commercial vehicles.
Rapid expansion of AI datacenter projects across the United States is projected to outpace the available supply of advanced chips, primarily due to constraints in advanced packaging capacity, potentially capping deployment at 20-25 gigawatts by 2027.
EVgo has detailed plans for a new DC fast charging system capable of delivering up to 750 kW, slated for deployment in 2027, promising a significant leap in charging speed and efficiency for electric vehicles.
A new patent reveals Intel's strategy to integrate MicroLEDs directly into chip packaging, potentially solving the bandwidth bottleneck through glass-substrate-based co-packaged optics.
New York is pushing a new wave of massive storage contracts to solve its grid impasse, but balancing ambitious decarbonization goals against historical bottlenecks remains a heavy lift.
Qualcomm unveiled two new flagship smartphone SoCs that can run a 30‑billion‑parameter mixture‑of‑experts model locally, marking a leap in on‑device AI performance and reshaping the mobile compute landscape.
Chinese battery giant CATL has launched its TECTRANS II platform for heavy-duty trucks, promising a 1,000-kilometer range that challenges diesel supremacy while raising critical questions about payload weight and megawatt charging infrastructure.
Nvidia's RTX Mega Geometry 2.0 SDK introduces dynamic VRAM streaming for ray-tracing assets, solving memory bottlenecks in complex rendering pipelines.
Noble Carbon's slot-in smart circuit breaker targets the residential electrification bottleneck by dynamically balancing household loads to bypass standard electrical panel upgrades.
The massive expansion of the Colossus supercomputer cluster highlights the shift in AI scaling bottlenecks from silicon availability to utility-scale power generation and liquid-cooling infrastructure.
Geely has introduced an AI-driven charging protocol that uses micro-pulse currents to mitigate the degradation typically associated with ultra-fast EV charging.
Recent hardware stress testing reveals that Nvidia's flagship GeForce RTX 5090 pushes its 16-pin power connector past 90 degrees Celsius at peak 650W draws, highlighting critical thermal engineering challenges in high-wattage consumer silicon.
Micron is phasing out production of 2GB GDDR7 memory modules to prioritize higher-density 3GB parts, illustrating a broader structural shift in memory manufacturing toward high-margin AI hardware.
X-energy's advanced small modular reactor project has secured a $1 billion federal award, accelerating its path toward commercial deployment and signaling a renewed governmental commitment to next-generation nuclear power as a clean energy solution.
Singapore startup Nexstrom secures fresh capital to build scalable manufacturing equipment for transition metal dichalcogenides, aiming to move 2D semiconductors out of the academic lab and into commercial semiconductor fabrication lines.
A deepening conflict between Con Edison and energy storage developers in New York City highlights the technical and bureaucratic hurdles facing community-scale battery deployment.
For the first time, the manufacturing cost of advanced DRAM on a per-area basis has surpassed that of leading-edge compute chips, signaling a fundamental shift in semiconductor economics driven by the escalating demands of artificial intelligence workloads.
Geely's move to a 2.2MW charging architecture signals a shift toward heavy-duty power delivery to overcome the physical limits of current battery thermal management and grid integration.
Researchers in China have demonstrated 3nm-class gate-all-around transistors without EUV lithography, signaling a shift in manufacturing strategy despite significant yield and density hurdles.
Vistra’s Moss Landing facility has suffered another fire, raising critical questions about the reliability and safety standards of large-scale lithium-ion grid storage deployments.
Beyond the silicon performance metrics, the rapid scaling of AI infrastructure is creating a massive, overlooked crisis in hardware lifecycle management and electronic waste.