All stories tagged advanced-packaging on The Silicon Valley News.
Taiwanese prosecutors are investigating major chip substrate supplier Unimicron over allegations of 'origin washing' Chinese-made components to evade U.S. tariffs, threatening key supply lines for Nvidia and Intel.
While glass-core substrates are poised to revolutionize chip packaging with superior electrical and thermal properties, their commercial deployment remains elusive, challenging industry roadmaps for next-generation silicon.
As a global high-bandwidth memory shortage bites, Nvidia is reportedly testing Rubin Ultra configurations with as little as 192 GB of HBM4, forcing a strategic shift in next-generation AI cluster architecture.
As traditional copper interconnects hit physical limits, major foundries are racing to deploy co-packaged optics, each taking a fundamentally different approach to silicon photonics integration.