All stories tagged packaging on The Silicon Valley News.
A new five-year, $2 billion agreement brings GlobalFoundries into TSMC's advanced packaging ecosystem, utilizing mature US fabs to relieve AI hardware bottlenecks.
LG's new maskless Laser Direct Imaging machine aims to solve the critical throughput constraints currently plaguing high-density chip packaging and interconnect scaling.
Google is reportedly collaborating with AMD to develop a next-generation Tensor Processing Unit that integrates custom CPU cores on-package to handle the complex, sequential logic required for reinforcement learning and agentic AI workloads.
As vertical high-bandwidth memory stacks hit a critical thermal ceiling, packaging engineers are turning to lateral integration and hybrid bonding to sustain AI accelerator scaling.