All stories tagged packaging on The Silicon Valley News.
LG's new maskless Laser Direct Imaging machine aims to solve the critical throughput constraints currently plaguing high-density chip packaging and interconnect scaling.
Google is reportedly collaborating with AMD to develop a next-generation Tensor Processing Unit that integrates custom CPU cores on-package to handle the complex, sequential logic required for reinforcement learning and agentic AI workloads.
As vertical high-bandwidth memory stacks hit a critical thermal ceiling, packaging engineers are turning to lateral integration and hybrid bonding to sustain AI accelerator scaling.