All stories tagged semiconductors on The Silicon Valley News.
Helion has secured $225 million to advance custom semiconductor components aimed at doubling the output capacity of its upcoming commercial fusion reactors.
A shift toward processing monazite ore could dismantle China's dominance in rare earth elements, offering a radioactive but viable path to domestic chip manufacturing security.
TSMC is actively pressing lithography and etch equipment vendors to eliminate Chinese rare-earth components from their systems to protect fab operations against escalating geopolitical supply chain disruptions.
Cloud hyperscalers are launching open software abstraction layers that allow PyTorch workloads to execute seamlessly on custom silicon, threatening Nvidia's long-standing CUDA software moat.
A new software-based approach to Nvidia GPU configuration allows users to modify power limits and clock speeds via direct register overrides, bypassing the risks of traditional firmware flashing.
Computer architecture startup Tenstorrent has raised $1.5 billion at a $6.2 billion valuation, deploying capital to scale its open RISC-V hardware and offer an alternative to proprietary AI chips.
Intel Foundry Services is reportedly securing new customers, raising questions about whether previous cost-cutting initiatives might hinder its long-term capacity and technological readiness for broader industry demands.
A $4 billion industrial park in Texas aims to transplant Taiwan's specialized chemicals, precision tooling, and packaging suppliers directly alongside domestic fab expansions.
Applied Materials' new multi-billion dollar EPIC Center represents a necessary shift in semiconductor manufacturing, moving from siloed development to integrated co-optimization of materials, equipment, and process architecture.
Broadcom CEO Hock Tan warns that many technology investors are gambling blindly on infrastructure without understanding future profitability.
SK hynix is moving away from generic Arm architectures for I/O management, introducing bespoke H-TPU cores to handle the massive throughput of next-generation enterprise storage.
Intel's new GPU D-Series family, powered by the Crescent Island AI inference accelerator, promises substantial FP8 compute and high memory bandwidth, targeting AI workloads with specific performance metrics.
Seven years after abandoning the FinFET race, GlobalFoundries pivots back to advanced scaling with a 7nm-class FD-SOI node targeting high-efficiency AI and RF applications.
Researchers have demonstrated a method using controlled oxygen introduction to regulate transition metal dichalcogenide growth, addressing critical nucleation flaws for future sub-nanometer logic nodes.
Nvidia is reportedly reallocating resources from its top-tier consumer graphics cards, the GeForce RTX 5090, to bolster production of AI data center and professional GPUs, signaling a strategic shift driven by overwhelming AI demand.
A new five-year, $2 billion agreement brings GlobalFoundries into TSMC's advanced packaging ecosystem, utilizing mature US fabs to relieve AI hardware bottlenecks.
Rapid expansion of AI datacenter projects across the United States is projected to outpace the available supply of advanced chips, primarily due to constraints in advanced packaging capacity, potentially capping deployment at 20-25 gigawatts by 2027.
Micron is phasing out production of 2GB GDDR7 memory modules to prioritize higher-density 3GB parts, illustrating a broader structural shift in memory manufacturing toward high-margin AI hardware.
Singapore startup Nexstrom secures fresh capital to build scalable manufacturing equipment for transition metal dichalcogenides, aiming to move 2D semiconductors out of the academic lab and into commercial semiconductor fabrication lines.
For the first time, the manufacturing cost of advanced DRAM on a per-area basis has surpassed that of leading-edge compute chips, signaling a fundamental shift in semiconductor economics driven by the escalating demands of artificial intelligence workloads.
Researchers in China have demonstrated 3nm-class gate-all-around transistors without EUV lithography, signaling a shift in manufacturing strategy despite significant yield and density hurdles.
Huawei has pulled forward its Ascend NPU roadmap, signaling a strategic shift to maintain domestic AI compute parity as export controls tighten around advanced silicon.
Intel’s unveiling of the Diamond Rapids server architecture at Hot Chips 2026 marks a decisive shift toward high-bandwidth density and modular compute design for the data center.
TSMC has detailed its timeline for integrating High-NA EUV lithography into its production roadmap by 2030, targeting A10 or A11 process technologies, marking a critical step for future transistor scaling and chip density.
The European Union's ambitious plan for AI sovereignty is being throttled by a structural dependence on non-European silicon and advanced foundry capacity.
AMD's new Threadripper Halo Station pushes the boundaries of local compute, integrating dual MI350P accelerators and massive memory bandwidth to enable trillion-parameter model inference on a workstation.
TSMC's equipment procurement needs have surged dramatically due to unprecedented AI-driven demand, yet its capital expenditure growth lags, signaling potential capacity constraints for advanced silicon production.
A staggering $32 trillion is projected for global AI data center investments by 2050, signaling an unprecedented infrastructure build-out that will redefine demand for advanced silicon, power grids, and cooling technologies, far exceeding prior industrial revolutions.
By licensing its high-speed NVLink interconnect IP to custom chip designers, Nvidia is positioning itself at the physical core of competitors' custom ASICs.
As AI data centers shift toward optical interconnects and advanced nodes, China's control over critical rare earths erbium and yttrium poses a severe threat to hardware scaling.
While the U.S. pours billions into physical fabrication capacity, the GAO warns that R&D funding remains stagnant, threatening the long-term viability of the domestic semiconductor ecosystem.
As SK Hynix breaks ground in Indiana, the firm is signaling a shift toward regionalized production and deeper integration with Japanese partners to secure its lead in the high-bandwidth memory market.
Nvidia’s rapid deployment of the Vera Rubin platform highlights a strategic pivot toward high-bandwidth, liquid-cooled AI infrastructure at an unprecedented scale.
While glass-core substrates are poised to revolutionize chip packaging with superior electrical and thermal properties, their commercial deployment remains elusive, challenging industry roadmaps for next-generation silicon.
Fujitsu's upcoming 144-core Monaka server CPU shifts to a disaggregated chiplet design, stacking its entire cache on a dedicated 5nm die while narrowing its vector units to 256-bit SVE2.
Despite a 20% contraction in the desktop CPU market, AMD has hit record market share, signaling a fundamental divergence in how Intel and AMD are navigating the current silicon glut.
LG's new maskless Laser Direct Imaging machine aims to solve the critical throughput constraints currently plaguing high-density chip packaging and interconnect scaling.
The conviction of a former Samsung engineer reveals the technical blueprints behind CXMT's push to bypass years of DRAM process development and challenge global memory leaders.
Samsung Foundry has reportedly raised contract prices by up to 15 percent on its mature and advanced nodes, signaling tight capacity and a shifting geopolitical landscape for fabless designers.
By deploying its first physical silicon cluster with Jane Street, chip startup Etched is demonstrating that application-specific integrated circuits dedicated to transformer models can compete with general-purpose GPUs in high-stakes production environments.