All stories tagged semiconductors on The Silicon Valley News.
The European Union's ambitious plan for AI sovereignty is being throttled by a structural dependence on non-European silicon and advanced foundry capacity.
AMD's new Threadripper Halo Station pushes the boundaries of local compute, integrating dual MI350P accelerators and massive memory bandwidth to enable trillion-parameter model inference on a workstation.
TSMC's equipment procurement needs have surged dramatically due to unprecedented AI-driven demand, yet its capital expenditure growth lags, signaling potential capacity constraints for advanced silicon production.
A staggering $32 trillion is projected for global AI data center investments by 2050, signaling an unprecedented infrastructure build-out that will redefine demand for advanced silicon, power grids, and cooling technologies, far exceeding prior industrial revolutions.
By licensing its high-speed NVLink interconnect IP to custom chip designers, Nvidia is positioning itself at the physical core of competitors' custom ASICs.
As AI data centers shift toward optical interconnects and advanced nodes, China's control over critical rare earths erbium and yttrium poses a severe threat to hardware scaling.
While the U.S. pours billions into physical fabrication capacity, the GAO warns that R&D funding remains stagnant, threatening the long-term viability of the domestic semiconductor ecosystem.
As SK Hynix breaks ground in Indiana, the firm is signaling a shift toward regionalized production and deeper integration with Japanese partners to secure its lead in the high-bandwidth memory market.
Nvidia’s rapid deployment of the Vera Rubin platform highlights a strategic pivot toward high-bandwidth, liquid-cooled AI infrastructure at an unprecedented scale.
While glass-core substrates are poised to revolutionize chip packaging with superior electrical and thermal properties, their commercial deployment remains elusive, challenging industry roadmaps for next-generation silicon.
Fujitsu's upcoming 144-core Monaka server CPU shifts to a disaggregated chiplet design, stacking its entire cache on a dedicated 5nm die while narrowing its vector units to 256-bit SVE2.
Despite a 20% contraction in the desktop CPU market, AMD has hit record market share, signaling a fundamental divergence in how Intel and AMD are navigating the current silicon glut.
LG's new maskless Laser Direct Imaging machine aims to solve the critical throughput constraints currently plaguing high-density chip packaging and interconnect scaling.
The conviction of a former Samsung engineer reveals the technical blueprints behind CXMT's push to bypass years of DRAM process development and challenge global memory leaders.
Samsung Foundry has reportedly raised contract prices by up to 15 percent on its mature and advanced nodes, signaling tight capacity and a shifting geopolitical landscape for fabless designers.
By deploying its first physical silicon cluster with Jane Street, chip startup Etched is demonstrating that application-specific integrated circuits dedicated to transformer models can compete with general-purpose GPUs in high-stakes production environments.
Driven by US export controls and the diminishing returns of throttled Western GPUs, Chinese hyperscalers are pivoting to domestic silicon, forcing a rapid maturation of the country's independent semiconductor ecosystem.
Geopolitical volatility and resource concentration continue to threaten semiconductor production, highlighting the urgent need for supply chain diversification beyond current regional dependencies.
Intel is extending the lifecycle of its LGA 1700 platform, citing a surge in demand for Raptor Lake as high DDR5 memory costs keep cost-conscious builders tethered to DDR4.
Intel's successful $19.7 billion capital raise provides the critical financial runway needed to scale its 14A process node and deploy expensive High-NA EUV lithography.
As a global high-bandwidth memory shortage bites, Nvidia is reportedly testing Rubin Ultra configurations with as little as 192 GB of HBM4, forcing a strategic shift in next-generation AI cluster architecture.
SpaceX's decision to power its Texas semiconductor plant with natural gas instead of Tesla solar highlights the limits of renewables for high-uptime industrial manufacturing.
Chinese memory maker CXMT has demonstrated DDR5-8800 speeds on AMD platforms, proving that domestic silicon can match the performance of global giants despite strict export controls.
As the semiconductor industry prepares for the post-nanosheet era, leading chipmakers are splitting over whether monolithic or sequential integration is the viable path for complementary FETs.
As vertical high-bandwidth memory stacks hit a critical thermal ceiling, packaging engineers are turning to lateral integration and hybrid bonding to sustain AI accelerator scaling.
As physical limits choke copper's conductivity at advanced nodes, researchers are turning to topological materials and exotic quasiparticles to solve the semiconductor interconnect crisis.
The semiconductor industry faces a prolonged memory supply crisis as the production of high-bandwidth memory for AI hardware consumes disproportionate wafer allocations.
TSMC reports that its A14 process technology is progressing ahead of N2, delivering notable yield and performance gains, drawing strong interest from AI, HPC, and smartphone sectors.
Apple is designing the M7 Ultra chip to support up to 1.5TB of unified memory and AI performance rivaling Nvidia's Blackwell accelerators, signaling a major leap in SoC capabilities contingent on easing memory constraints.
Japanese chipmaker Rapidus aims to disrupt the advanced foundry market with 2nm-class silicon priced around $20,000 per wafer, undercutting TSMC's rates and challenging established pricing norms.
QuantumDiamonds, a German startup backed by the European Chips Act, is advancing a novel chip inspection technology aimed at speeding semiconductor manufacturing.