Silicon, foundries, GPUs — the substrate of everything.
137 stories · page 3 of 6
Microsoft's Project Zenith, a specialized Windows 11 build for AI developers, will debut on AMD's Ryzen AI Halo platform, setting a new benchmark with requirements for 64GB RAM and 250 GB/s memory bandwidth.
AMD's new Threadripper Halo Station pushes the boundaries of local compute, integrating dual MI350P accelerators and massive memory bandwidth to enable trillion-parameter model inference on a workstation.
Nvidia's upcoming RTX Spark N1X silicon marks a major shift in the PC and workstation landscape, combining up to 20 CPU cores with massive CUDA configurations and unified memory.
TSMC's equipment procurement needs have surged dramatically due to unprecedented AI-driven demand, yet its capital expenditure growth lags, signaling potential capacity constraints for advanced silicon production.
A staggering $32 trillion is projected for global AI data center investments by 2050, signaling an unprecedented infrastructure build-out that will redefine demand for advanced silicon, power grids, and cooling technologies, far exceeding prior industrial revolutions.
By licensing its high-speed NVLink interconnect IP to custom chip designers, Nvidia is positioning itself at the physical core of competitors' custom ASICs.
Taiwanese prosecutors are investigating major chip substrate supplier Unimicron over allegations of 'origin washing' Chinese-made components to evade U.S. tariffs, threatening key supply lines for Nvidia and Intel.
As AI data centers shift toward optical interconnects and advanced nodes, China's control over critical rare earths erbium and yttrium poses a severe threat to hardware scaling.
While the U.S. pours billions into physical fabrication capacity, the GAO warns that R&D funding remains stagnant, threatening the long-term viability of the domestic semiconductor ecosystem.
Nvidia’s rapid deployment of the Vera Rubin platform highlights a strategic pivot toward high-bandwidth, liquid-cooled AI infrastructure at an unprecedented scale.
While glass-core substrates are poised to revolutionize chip packaging with superior electrical and thermal properties, their commercial deployment remains elusive, challenging industry roadmaps for next-generation silicon.
Fujitsu's upcoming 144-core Monaka server CPU shifts to a disaggregated chiplet design, stacking its entire cache on a dedicated 5nm die while narrowing its vector units to 256-bit SVE2.
IBM's new mainframe chip natively executes both z/Architecture and ARM instructions within a single core, built on a 2nm process node, signaling a strategic move to broaden software support and enhance enterprise computing flexibility.
A reported 15 percent price increase on Nvidia's next-generation AI platforms highlights how high-bandwidth memory bottlenecks and packaging yields are dictating system economics.
Despite a 20% contraction in the desktop CPU market, AMD has hit record market share, signaling a fundamental divergence in how Intel and AMD are navigating the current silicon glut.
LG's new maskless Laser Direct Imaging machine aims to solve the critical throughput constraints currently plaguing high-density chip packaging and interconnect scaling.
The conviction of a former Samsung engineer reveals the technical blueprints behind CXMT's push to bypass years of DRAM process development and challenge global memory leaders.
Samsung Foundry has reportedly raised contract prices by up to 15 percent on its mature and advanced nodes, signaling tight capacity and a shifting geopolitical landscape for fabless designers.
Driven by US export controls and the diminishing returns of throttled Western GPUs, Chinese hyperscalers are pivoting to domestic silicon, forcing a rapid maturation of the country's independent semiconductor ecosystem.
With backing from AMD, Renesas, and Boeing, the Xen Project is pursuing safety-critical certifications to enable secure hardware virtualization in automotive and aerospace systems.
Google is reportedly collaborating with AMD to develop a next-generation Tensor Processing Unit that integrates custom CPU cores on-package to handle the complex, sequential logic required for reinforcement learning and agentic AI workloads.
Geopolitical volatility and resource concentration continue to threaten semiconductor production, highlighting the urgent need for supply chain diversification beyond current regional dependencies.
Intel is extending the lifecycle of its LGA 1700 platform, citing a surge in demand for Raptor Lake as high DDR5 memory costs keep cost-conscious builders tethered to DDR4.
Advanced multiphysics simulation tools are becoming indispensable for identifying and mitigating failure points in high-voltage electronics, a critical requirement for electric vehicles, data centers, and renewable energy infrastructure.